The XtremeSpeed™ RO1200™ Series from Rogers Corporation comprises extremely low-loss digital circuit laminates engineered for high-speed applications requiring exceptional electrical performance and mechanical stability.
The XtremeSpeed™ RO1200 Bondply is an advanced, extremely low-loss, ceramic-filled, non-glass reinforced PTFE bonding material developed by Rogers Corporation. It is engineered for high-speed digital applications, offering exceptional electrical and mechanical performance.
The Quick Reference Processing Guidelines for RO1200 Materials provide essential recommendations to ensure optimal fabrication and performance of these advanced laminates.
PSIS – RO1200 Laminate Series refers to advanced circuit materials from Rogers Corporation designed for high-frequency and high-speed digital applications. The RO1200 laminates are part of Rogers’ XtremeSpeed™ series, offering ultra-low loss characteristics, excellent thermal stability, and outstanding mechanical reliability
XtremeSpeed RO1200 materials are advanced, extremely low-loss digital circuit laminates developed by Rogers Corporation. These materials are engineered to offer exceptional electrical performance and mechanical stability for high-speed applications.
R-1755V is a high-reliability glass epoxy multi-layer laminate developed by Panasonic, designed for applications requiring excellent thermal and mechanical performance.
Tlam SS HTD is a thermally conductive printed circuit board (PCB) substrate developed by Laird Technologies. It is engineered to provide superior thermal management in high-temperature and high-voltage applications, such as industrial motor drives and automotive motor controls.
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HF-140 is a high-performance laminate material designed for applications that require excellent thermal reliability, lead-free soldering compatibility, and environmentally friendly properties. This laminate is typically used in the manufacturing of printed circuit boards (PCBs) for various electronic applications.
IT-968 is a high-performance laminate and prepreg material developed by ITEQ Corporation, designed for applications requiring high glass transition temperature (Tg), lead-free compatibility, and ultra-low loss characteristics.