The RO4500™ series antenna-grade laminates are designed to provide a cost-effective solution for high-frequency applications. These laminates offer exceptional electrical performance, high thermal reliability, and ease of processing, making them ideal for a wide range of antenna and wireless communication systems.
The RO4400® series bondply materials are designed for use in multilayer high-frequency circuit constructions. These bondplys provide excellent dielectric performance, low loss, and high thermal reliability. RO4450F™ and RO4460G2™ are compatible with Rogers RO4000® laminates, ensuring a seamless integration for complex RF and microwave applications.
RO4000® laminates with TICER® TCR thin film resistor foils combine the high-frequency performance of Rogers RO4000® laminates with the versatility of integrated thin film resistors. These materials are designed to simplify circuit fabrication, enhance performance, and reduce component count in RF and microwave applications.
RO4360G2™ laminates are high-frequency materials with a dielectric constant (Dk) of 6.15 ± 0.15, designed for RF, microwave, and high-power applications. They are compatible with FR-4 processing methods, offering a cost-effective and efficient manufacturing process.
With the continuous development of electronic components, thermal management in modern electronic products has become increasingly important. Especially in highly integrated and miniaturized electronic devices, ensuring that circuit boards and components operate within the proper temperature range is a critical task for enhancing product performance and reliability. Infrared thermal imaging technology, as a non-contact temperature measurement tool, has been widely applied in the design, validation, fault diagnosis, and thermal management processes of electronic products. This article will explore the basic principles, advantages, and applications of infrared thermal imaging in the electronics industry, specifically how it helps optimize thermal management and improve product performance.
RO4360G2™ laminates from Rogers Corporation are high-frequency materials with a dielectric constant (Dk) of 6.15 ± 0.15, designed for advanced RF and microwave applications. These laminates are compatible with FR-4 processing methods, making them a cost-effective solution for high-performance circuits. The following guidelines help optimize fabrication processes to ensure reliability and performance.
Device Attachment Methods and Wirebonding Notes for RTduroid and RO4000 Series High Frequency Lamina
The attachment of devices and wirebonding onto RT/duroid® and RO4000® series laminates requires careful consideration to maintain the integrity of high-frequency circuits. These laminates are designed for RF and microwave applications, and proper handling ensures optimal performance and reliability.
Rogers RO4360G2™ laminates are engineered for RF and microwave applications that demand a high dielectric constant (Dk) and robust mechanical performance. These laminates provide enhanced circuit density, lower signal loss, and improved thermal conductivity, making them ideal for advanced designs in telecommunications, aerospace, and automotive radar systems.
The SP200501 document provides detailed starting point compensation factors for Rogers RO4350B™ laminates. These factors are essential for optimizing PCB fabrication processes and ensuring precise dimensional control during etching, drilling, and lamination. By accounting for the material’s inherent properties and processing behavior, manufacturers can achieve high precision in RF and microwave circuit designs.
Rogers RO4000® series laminates combined with TICER® TCR Thin Film Resistor Foils offer a high-performance solution for designing circuits that require integrated resistors. This combination is ideal for applications in RF and microwave industries, where precise impedance control, circuit miniaturization, and low parasitic effects are critical.