Creep is the slow, time-dependent deformation of materials under mechanical stress, which can lead to reliability issues in printed circuit board assemblies (PCBAs). It becomes particularly significant at elevated temperatures or under constant stress
RT-duroid® microwave laminates are highly regarded for their exceptional electrical, thermal, and mechanical properties. These attributes have been leveraged in a cryogenic stripline application at NASA, where the material’s performance under extreme low-temperature conditions was critical.
RT-duroid® 5870 and 5880 are high-performance laminates with exceptional electrical properties, making them ideal for high-frequency and microwave applications. These materials are PTFE-based composites with excellent dielectric uniformity and low loss, reinforced with glass microfiber for mechanical stability. Proper fabrication techniques are essential to preserve their properties and ensure reliable performance.
Striplines are transmission lines embedded within a dielectric medium and are widely used in high-frequency circuits for their excellent signal integrity and predictable impedance. Broadside and edgewise striplines are two common configurations, differing in how the signal and ground planes are arranged. Understanding the design equations is crucial for impedance control and circuit optimization.
RT-duroid® laminates are widely used for high-frequency applications, offering excellent dielectric properties and dimensional stability. However, after the etching process used to define circuit patterns, internal stresses can develop in the laminate, potentially affecting its performance and reliability.
RT-duroid® 5870 laminates, consisting of a PTFE-based substrate reinforced with glass microfiber and bonded to copper foil, are widely used in high-frequency applications. The adhesion between the copper foil and the PTFE substrate is a critical factor for the reliability and performance of these laminates, particularly during soldering processes.
RT-duroid® laminates, based on polytetrafluoroethylene (PTFE) reinforced with glass microfibers or ceramics, are commonly used in high-frequency applications. When exposed to nuclear radiation, these materials exhibit specific changes in physical, electrical, and mechanical properties.
The nearly isotropic dielectric constant (ϵr\epsilon_rϵr) of RT-duroid® 5870 – 5880 laminates, attributed to their glass microfiber-reinforced PTFE composition, offers several key benefits for high-frequency applications.
hen Rogers high-frequency circuit boards, such as RT-duroid laminates, carry direct current (DC) or radio frequency (RF) current, the temperature rise depends on factors such as conductor resistance, material properties, current flow, and thermal management.