Copper is both an excellent conductor of electricity and an excellent conductor of heat, making it an ideal conductor for most PCB applications
Multilayer circuits occupy more vertical space than horizontal space, allowing designs to be stacked in a compact space. The number of layers in a circuit refers to the number of conductor layers in the circuit, usually separated by dielectric layers
5G communication has the technical characteristics of high frequency, broadband, and high power density, and its demand for RF front-end devices has also increased significantly. At the same time, in order to control the volume of the assembled device, the modularization of the RF front-end is inevitable. The RF front-end module integrates the power amplifier (PA), filter (SAW, TF-SAW BAW, etc.), antenna, switch (Switch) and low noise amplifier (LNA), passive devices, etc. in one module
Circuit materials are exposed to high temperatures for short periods of time during processing and for longer periods of time during use. The effects of long-term high temperatures are often seen as oxidation accumulation on PCB thermoset dielectric materials, which can cause a shift in the Dk of the circuit material. Determining how sensitive a circuit material is to the effects of long-term aging requires precise and careful testing, as different measurement methods and techniques can yield very different measurement results when characterizing high-frequency circuit materials. Selecting the right test method, whether it is material-based or circuit-based testing, provides reliable data when modeling Dk and circuits.
The electronics industry has undergone many changes over the past few years. Nowadays, millimeter wave radar and millimeter wave communication frequently appear in our sight. In particular, Huawei has made remarkable achievements in 5G, and millimeter wave technology has been put on the table. Why does millimeter wave technology play such a key role in 5G and smart cars? Next, let’s take a closer look at the past and present of millimeter wave technology and its continuation.
Difficulties in high frequency board processing
1. Copper deposition: It is not easy to copperize the hole wall
2. Control of line gaps and sand holes in pattern transfer, etching, line width
3. Green oil process: control of green oil adhesion and green oil bubbling
4. Strict control of board scratches in each process, etc.
The basic premise of search engine reputation management is to use the following three strategies to accomplish the goal of creating a completely positive first page of search engine results for a specific term…
The basic premise of search engine reputation management is to use the following three strategies to accomplish the goal of creating a completely positive first page of search engine results for a specific term…
The basic premise of search engine reputation management is to use the following three strategies to accomplish the goal of creating a completely positive first page of search engine results for a specific term…
As complexity and density increase, the long-term reliability of RF/microwave circuit components becomes more challenging to characterize. Printed Circuit Boards (PCBs) comprise numerous active and passive components, whose performance can vary over time and with operating environment temperatures. Additionally, PCB substrate materials, such as dielectrics, copper foil conductors, solder mask inks, and final finishes, may change over time, influenced by environmental conditions. Higher frequencies may experience changes in electrical performance over time, such as power and efficiency losses. These effects can occur in both short-term and long-term scenarios, often driven by thermal effects, particularly when operating in high-temperature environments.
