High frequency PCBs are specialized circuit boards designed to transmit signals over a gigahertz (GHz) frequency range, ensuring quick and reliable communication in devices ranging from military radar systems to smartphones.
KB6160+FR4 is a hybrid laminate combining the high-performance properties of KB6160 material with standard FR4 epoxy-based laminates. This unique combination offers excellent signal integrity for high-frequency applications while maintaining cost-effectiveness and versatility. It is suitable for multilayer PCB designs requiring a balance between performance and affordability.
HF-140 is a high-frequency laminate designed for RF, microwave, and high-speed digital applications. Its unique properties ensure low signal loss, stable electrical performance, and compatibility with complex circuit designs, making it suitable for demanding environments such as telecommunications, aerospace, and automotive systems
CLTE Series laminates are high-frequency materials designed for precision and reliability in RF, microwave, and millimeter-wave applications. Follow these quick reference guidelines to optimize fabrication and achieve high-quality results.
CLTE Series laminates are high-performance, ceramic-filled PTFE composites specifically engineered for RF, microwave, and millimeter-wave applications. These laminates exhibit excellent electrical properties, mechanical robustness, and thermal stability, making them ideal for advanced circuit designs requiring precision and reliability.
CLTE Series laminates are engineered for high-frequency applications requiring exceptional electrical performance and dimensional stability. These ceramic-filled PTFE composites are designed to ensure reliable processing in various manufacturing environments. Following the recommended guidelines will optimize yield, maintain product integrity, and ensure long-term reliability.
CLTE-AT laminates are advanced, low-loss, ceramic-filled PTFE composite materials designed for high-performance applications. These laminates are engineered for demanding RF, microwave, and millimeter-wave circuits, offering exceptional thermal, mechanical, and electrical stability. With a low coefficient of thermal expansion (CTE) and high reliability, they are particularly suited for multilayer applications requiring tight tolerance and excellent signal integrity.
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ThinFlex-A, A-2010RD is a high-performance, adhesive-less double-sided copper clad laminate, specifically designed for use in advanced printed circuit board (PCB) applications. This laminate is ideal for high-frequency, high-speed, and high-temperature environments where superior electrical and mechanical properties are required. ThinFlex-A, A-2010RD provides exceptional performance without the use of adhesive bonding agents, ensuring higher reliability, reduced signal loss, and improved overall mechanical strength.
TSM-DS3 is a high-performance microwave and RF laminate material, designed specifically for high-frequency applications requiring low signal loss and stable dielectric properties. This material is widely used in communication systems, automotive electronics, and other industries that demand precise and reliable signal transmission.