One-stop PCB Manufacturing and PCB Assembly solutions Manufacturer
- Mon - Sat: 8.00 am - 7.00 pm
- sales@kkpcb.com
BGA PCB Assembly
//ems product display PCB Manufacturing
PCB Manufacturing
and PCB Assembly
KKPCB conducts research on special processing technologies such as ordinary double-sided boards, thick copper circuit boards, high-frequency circuit boards, HDI circuit boards, rigid-flexible circuit boards, FPC flexible boards, buried blind hole circuit boards, and IC carrier boards. Provides PCB design, PCB layout, PCB prototyping and PCB assembly services.
// BGA PCB Assembly
Benefits of Our BGA PCB Service
KKPCB has been providing BGA assembly, including BGA Rework and BGA Reballing services in the Printed Circuit Board Assembly industry since 2012. With state-of-the-art BGA placement equipment, high-precision BGA assembly processes, cutting-edge X-Ray Inspection equipment, and highly customizable Complete PCB Assembly solutions, you can rely on us to build high quality and high yield BGA boards.
Efficient Use of Space
BGA PCB layout allows us to efficiently use the available space. Hence, we can mount more components and manufacturer lighter devices.
Less Damage to Leads
We use solid solder balls for manufacturing BGA leads. Hence, there is a lesser risk that they will get damaged during operation.
Excellent Thermal and Electrical Performance
Actions consistent with words Maintain Excellent Workforce
Customer service oriented
Quick to respond
Flexible
Highly productive
Lower Cost
The smaller size and the convenient manufacturing route ensure that we incur lower manufacturing costs. Hence, this process is ideal for mass production.
Higher Manufacturing Yields
The most BGA PCB design is smaller in size so they are faster to manufacture. Hence, we get higher manufacturing yields and the process becomes more convenient.
Quality Assurance
Our rigorous quality control processes and extensive testing procedures guarantee that every PCB assembly we produce meets the highest industry standards for reliability and performance, giving you peace of mind and confidence in our services.
-01
BGA Assembly Capabilities
| Supported Capabilities | |
|---|---|
| Leadless BGAs | Micro Ball Grid Array (µBGA) Thin Chip Array Ball Grid Array (CTBGA) Chip Array Ball Grid Array (CABGA) Very Thin Chip Array Ball Grid Array (CVBGA) Very Fine Pitch Ball Grid Array (VFBGA) Land Grid Array (LGA) Chip scale Package (CSP) Wafer level chip scale packaging (WLCSP) |
| BGA Assembly Size | 2mm x 3mm/1x1mm to 45mm/50x50mm |
| Passive Footprints | 0201, Press fit, 01005, POP, 0603, and 0402. |
| Pitch Size | Minimum pitch sizes 0.4mm and placement accuracy +/- 0.03 mm |
| No. of layers | Up to 36 |
| Equipment | automatic placement machines, automated solder dispensing machines, reflow oven, X-ray and AOI inspection systems |
| BGA Assembly Service Types | Plastic BGA (PBGA) Ceramic BGA (CBGA) Micro BGA Micro Fine Line BGA (MBGA) Stack BGAs Lead BGA and leadless BGA |
| Testing and Inspection | X-ray inspection for several chip packages. We also provide functional testing and Automated Optical Inspection (AOI). |
-02
BGA Assembly Testing Capabilities
KKPCB is doing its best to make sure you achieve the level of optimization and reliability required. We use Surface Mount Technology (SMT) inspection or BGA inspection to analyze the chip-PCB connections. We constantly monitor various aspects of the assembly using a variety of inspection techniques like
- Optical Inspection
- Mechanical Inspection
- X-ray Inspection
Optical Inspection
We closely view the ball grid array connections with the surface of the PCB using the proper equipment like an endoscope. We have deployed efficient personnel and employed the equipment for optical inspection in the market for assessing the quality of the assembly process.
Mechanical Testing
This is done through shock tests in which the full assembly is subjected to shock. The mechanical properties of the solder joints are evaluated by looking at and measuring the strain.
X-ray Inspection
We have adopted this most advanced method of BGA testing to get a clear picture of the entire process. Under the X-ray test, we see clearly the ball grid image where we visually analyze the connections that usually cannot be optically inspected. We constantly inspect the joints and monitor the quality. We make sure there are no alignment issues and the ball grid array connections are symmetrical.
We have sophisticated equipment and in-house capabilities to assemble BGA prototyping boards. With recent technologies and staggering 4 decades of experience, we carry out various BGA prototyping board services.We capitalize on the BGA packages’ shorter leads package for ensuring excellent electrical performance on the high-speed circuit boards. Any unwanted signal distortions are also curbed in the high-speed electronics applications.
-03
BGA PCB Assembly Techniques
KKPCB is capable of ensuring SMT quality and decrease assembly defects. With modern manufacturing methods, we have been providing the SMT assembly process of BGA components for all volume production.
Surface Mount technology
Before we go for the assembly process, we make sure all the components go through the preheat treatment to make sure that they are sensitive to humidity and high temperatures. Before proceeding to the mounting of components, eliminate the moisture. We are skilled in solder paste printing, and solder paste is easily printed on the BGA components. Our engineers are skilled in both horizontal and vertical printing.
BGA SMT Soldering
We mount the components with high precision and even under heavy vibrations, they remain unfazed. We have a specialized SMT assembly line containing chip mounter on & offline AOI equipment, reflow soldering oven, solder paste printer, BGA rework station, etc. We provide a solid foundation for the BGA assembly boards and live up to the customer expectations.
-04
Applications of BGA Assembly
With BGA assembly providing numerous advantages for high-density PCB products and allows excellent electrical performance and heat conduction.
BGA assembling techniques are quite commonly used in various applications that include
- Aerospace
- Automotive
- Autonomous applications
- Consumer electronics
- Industrial electronics
- Medical devices
- Military and defense
- Mobile pay
- Optoelectronics
- Semiconductors
- Test and measurement equipment
- Wearable electronics
- Wireless devices
- RF microwave
// FAQ BGA PCB Assembly
BGA PCB Assembly
Frequent Questions
What is BGA PCB Assembly?
BGA (Ball grid array) is an advanced packaging technology in SMT PCB assembly. With many ball-shaped bumps on the tube surface, a lot of interconnection points help achieve high-density package purposes. It offers short lead length and ample lead space that is an ideal solution for high-speed PCB products.
What are the features of your BGA assembly services?
Some of the features of our BGA assembly services are –
- High lead count
- No leads to bend
- Low inductance
- Takes less space on the board
- High interconnection density
- Low thermal resistance reducing the overheating
What are the benefits of ball grid array assembly?
Ball grid array assemblies are easy and extremely manageable using automated placement machines and also have excellent thermal dissipation capability. BGA packaging is also fit with high-efficiency system products. There is also considerable improvement in both thermal and electrical. Due to the reduction of the unnecessary lead inductance levels, you can achieve better performance at higher speeds. Also since there are no pins that can be bent and broken, the packaging is more stable.
What are the types of BGAs?
There are three different types of BGAs –
- TBGA (tape ball grid array)
- PBGA (plastic ball grid array)
- CBGA (ceramic ball grid array)
What are the things to consider when selecting a BGA assembly service?
Selecting a ball grid array assembly and manufacturing company is a challenging task in the competitive market. Some of the factors that need to be considered are –
- Quality
- Cost-effectiveness
- Customization
- Years of experience
- Turnaround time
- Flexibility & responsiveness
- Manufacturing capabilities
Why choose KKPCB for BGA PCB Assembly?
Choosing KKPCB for BGA PCB assembly is advantageous due to our expertise in handling complex BGA components, advanced assembly technologies, and strict quality controls. We offer precise soldering techniques, including reflow and X-ray inspection, to ensure reliable connections and high-performance results. Our commitment to using high-quality materials and our thorough testing procedures help prevent common issues such as solder joint defects and ensure the integrity of the final product. Additionally, our experienced team provides excellent support and quick turnaround times, making us a reliable partner for your BGA PCB assembly needs.
How do l get started with BGA assembly services?
To get started with BGA assembly services, define your project requirements, prepare essential documentation such as Gerber files and BOM, and contact us via our website, email, or phone. Submit a quote request if applicable, review and confirm the provided quote, and then initiate the assembly process. Stay in touch with our team for updates and address any questions or concerns as needed. This process will help ensure a smooth start to your BGA assembly project.
What does the BGA rework process comprises of?
Drop us a message and our experts begin with reviewing the BGA datasheet and PCB files to create a thermal profile for your BGA assembly. We conduct a detailed design for manufacturability (DFM) review for ensuring the appropriateness and also see that the specialized thermal profile prevents higher temperatures.
What is the estimated cost of BGA Assembly services?
The estimated cost of BGA assembly services depends on factors such as design complexity, quantity, component specifications, additional services, and lead time. For an accurate cost estimate, provide detailed project information, including Gerber files and BOM, and request a quote from us. We will evaluate your requirements and offer a tailored cost estimate based on your specific BGA assembly needs.
How can I get a quick quote for ball grid array (BGA) assembly?
You can request for a BGA Assembly quote in two ways; In first way, all you need to fill up the details in PCB assembly quote form and submit it. And in another way, you can email your specific requirements at sales@kkpcb.com.
// Drop us a line! We are here to answer your questions 24/7
