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PCB Material Specification Sheet
ROGERS

PSIS – RT-duroid 6002 Laminates

RT-duroid® 6002 laminates are PTFE-based high-frequency circuit materials reinforced with ceramic fillers. These laminates offer an exceptional combination of electrical and mechanical properties, making them ideal for microwave and RF applications. Their low dielectric constant (DkD_kDk​) and loss tangent are particularly suited for high-performance antennas, filters, and other critical RF components.

PCB Material Specification Sheet
ROGERS

Line Widths for Various Characteristic Impedance of Center Stripline Devices in RT duroid Laminates

In designing stripline circuits for high-frequency applications, maintaining the desired characteristic impedance (Z0Z_0Z0​) is crucial for signal integrity. The geometry of the trace, including line width, separation from ground planes, and material properties, plays a significant role in determining Z0Z_0Z0​. RT-duroid® laminates, with their excellent dielectric properties, are commonly used for such applications.

PCB Material Specification Sheet
ROGERS

Guidelines for Drilling RT-duroid 6002 Bonded Assemblies and Multilayer Boards

RT-duroid® 6002 laminates are widely used in high-frequency and microwave applications due to their excellent electrical and mechanical properties. Drilling is a critical step in fabricating bonded assemblies and multilayer boards with RT-duroid materials. Following the proper guidelines ensures clean vias, prevents delamination, and maintains structural integrity.

PCB Material Specification Sheet
ROGERS

Fabrication Guidelines RT-duroid 6002-6006-6010 High Frequency Circuit Materials

RT-duroid® 6000 series laminates are PTFE-based composite materials designed for high-frequency applications, offering excellent electrical properties, thermal stability, and low moisture absorption. These materials are ideal for RF and microwave circuits, including antennas, filters, and power dividers. Proper fabrication techniques are essential to achieve optimal performance and reliability.

PCB Material Specification Sheet
ROGERS

After Etch Stress Relief in RT-duroid Microwave Laminates

RT-duroid® microwave laminates are widely used in high-frequency applications due to their excellent electrical and mechanical properties. However, like many PTFE-based materials, RT-duroid laminates can experience stress after the etching process, which may affect the dimensional stability and performance of the final product. Stress relief procedures are essential to mitigate these effects and ensure reliable circuit fabrication.