CLTE Series laminates are engineered for high-frequency applications requiring exceptional electrical performance and dimensional stability. These ceramic-filled PTFE composites are designed to ensure reliable processing in various manufacturing environments. Following the recommended guidelines will optimize yield, maintain product integrity, and ensure long-term reliability.
CLTE-AT laminates are advanced, low-loss, ceramic-filled PTFE composite materials designed for high-performance applications. These laminates are engineered for demanding RF, microwave, and millimeter-wave circuits, offering exceptional thermal, mechanical, and electrical stability. With a low coefficient of thermal expansion (CTE) and high reliability, they are particularly suited for multilayer applications requiring tight tolerance and excellent signal integrity.
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ThinFlex-A, A-2010RD is a high-performance, adhesive-less double-sided copper clad laminate, specifically designed for use in advanced printed circuit board (PCB) applications. This laminate is ideal for high-frequency, high-speed, and high-temperature environments where superior electrical and mechanical properties are required. ThinFlex-A, A-2010RD provides exceptional performance without the use of adhesive bonding agents, ensuring higher reliability, reduced signal loss, and improved overall mechanical strength.
TSM-DS3 is a high-performance microwave and RF laminate material, designed specifically for high-frequency applications requiring low signal loss and stable dielectric properties. This material is widely used in communication systems, automotive electronics, and other industries that demand precise and reliable signal transmission.
The TRF series consists of high-performance, low-loss RF laminate materials designed for demanding applications in high-frequency and microwave circuit designs. Available in TRF-41, TRF-43, and TRF-45 variants, these materials offer excellent dielectric properties, low loss, and high thermal stability. They are ideal for use in advanced telecommunications, automotive, aerospace, and defense applications where signal integrity, reliability, and durability are critical.
TLY-5A is a high-performance RF laminate that provides low loss, stable dielectric properties, and excellent thermal stability, making it ideal for a wide range of microwave and RF circuit applications. This material is optimized for high-frequency designs, offering superior electrical performance and ease of processing in demanding environments.
TLY-5 is a high-performance, low-loss, and stable dielectric material designed for high-frequency applications. It is particularly well-suited for RF and microwave circuit designs, providing an excellent balance between electrical performance, thermal stability, and cost-effectiveness. TLY-5 is commonly used in high-speed, high-frequency signal applications, including antennas, filters, and high-frequency boards.
TLC-32 is a cost-effective RF substrate designed to meet the needs of high-frequency and microwave applications. It provides a balanced solution for applications that require reasonable performance at a lower cost. TLC-32 is suitable for various RF and microwave devices, including antennas, filters, and circuits, where a balance between cost and performance is crucial
RF-60TC is an advanced thermally conductive laminate designed for RF and microwave applications that demand high power handling and efficient heat dissipation. The material features a ceramic-filled PTFE composite that provides exceptional thermal conductivity and excellent electrical performance, ensuring stable and reliable operation across a wide range of frequencies