Shenzhen KKPCB Technology Co., Ltd. (KKPCB) is a professional PCB and PCBA manufacturer dedicated to providing one-stop electronic manufacturing solutions. Specializing in high-difficulty, small to medium batch PCB and PCBA production, we focus on delivering high-precision, high-reliability products with fast turnaround times to meet customers’ complex design and technical requirements.

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05, 258 Shenshan Rd, Longdong Community, Baolong St, Longgang Dist, Shenzhen, China

+86-177-4855-1367

Engineering Technology PCB Design/Layout
PCB Footprint

Advanced PCB Footprint Generator: Key to Efficient PCB Design

Creating a robust component library is one of the most challenging yet critical aspects of PCB design. The quality of the library, which includes schematic symbols, PCB footprints, and 3D models, directly impacts the success of your board development. Among these, the PCB footprint plays a pivotal role in determining whether your board can be manufactured and assembled correctly.

PCB Design/Layout Engineering Technology
RF Via Transitions in High-Speed Designs

RF Via Transitions in High-Speed Designs: Best Practices and Considerations

In high-speed and RF PCB designs, controlling trace impedance is critical, but the role of RF via transitions is often underestimated. Vias, which connect signals between layers, can introduce impedance mismatches, signal reflections, and losses, especially at high frequencies. Proper design and optimization of via transitions are essential to maintain signal integrity and ensure reliable performance in RF and high-speed digital applications

PCB Manufacturing
Solder Paste and Stencil Considerations for Double-Sided PCBs

Solder Paste and Stencil Considerations for Double-Sided PCBs

Designing double-sided PCBs requires careful planning to ensure efficient assembly, high yields, and reliable solder joints. Solder paste application and stencil design play a critical role in achieving these goals. This article explores key considerations for solder paste and stencil design, focusing on double-sided PCBs, component orientation, and advanced techniques for fine-pitch devices.