This article starts with the most basic PCB layout and discusses the role and design techniques of PCB layer stacking in controlling EMI radiation
High-frequency boards are the basis for the realization of microstrip circuit engineering. In the process of microstrip circuit design, sometimes the original design boards are out of stock, or it is necessary to use more reliable high-frequency boards for circuit design
Copper is both an excellent conductor of electricity and an excellent conductor of heat, making it an ideal conductor for most PCB applications
Multilayer circuits occupy more vertical space than horizontal space, allowing designs to be stacked in a compact space. The number of layers in a circuit refers to the number of conductor layers in the circuit, usually separated by dielectric layers
5G communication has the technical characteristics of high frequency, broadband, and high power density, and its demand for RF front-end devices has also increased significantly. At the same time, in order to control the volume of the assembled device, the modularization of the RF front-end is inevitable. The RF front-end module integrates the power amplifier (PA), filter (SAW, TF-SAW BAW, etc.), antenna, switch (Switch) and low noise amplifier (LNA), passive devices, etc. in one module
Circuit materials are exposed to high temperatures for short periods of time during processing and for longer periods of time during use. The effects of long-term high temperatures are often seen as oxidation accumulation on PCB thermoset dielectric materials, which can cause a shift in the Dk of the circuit material. Determining how sensitive a circuit material is to the effects of long-term aging requires precise and careful testing, as different measurement methods and techniques can yield very different measurement results when characterizing high-frequency circuit materials. Selecting the right test method, whether it is material-based or circuit-based testing, provides reliable data when modeling Dk and circuits.