OrCAD PCB Designer has the functionality to configure a 6-layer board, or any other type of PCB layer stackup to fit your exact needs
Key Takeaways
Defining two major concepts of board design and production: class and build.
An overview of the layout department’s responsibilities: library part generation as well as placement and routing.
Stepping more granularly through each task from schematic/design document reception to manufacturing files.
Changes in operating temperature environments are not always predictable, but they can be anticipated, especially for electronic applications that are exposed to outdoor temperatures and heat sources. Starting from the system’s circuit board, temperature effects can cause costly changes in circuit performance
Circuit pattern changes and minor anomalies are usually acceptable for low-frequency circuits, but the performance of millimeter-wave circuits is sensitive to circuit pattern changes and minor circuit anomalies
Circuit materials rely on high-quality conductors and dielectric materials to connect modern complex components to each other for optimal performance. However, these PCB copper conductors, whether DC or millimeter wave (mmWave) PCB boards, need protection against aging and oxidation
This article starts with the most basic PCB layout and discusses the role and design techniques of PCB layer stacking in controlling EMI radiation
High-frequency boards are the basis for the realization of microstrip circuit engineering. In the process of microstrip circuit design, sometimes the original design boards are out of stock, or it is necessary to use more reliable high-frequency boards for circuit design
Copper is both an excellent conductor of electricity and an excellent conductor of heat, making it an ideal conductor for most PCB applications
Multilayer circuits occupy more vertical space than horizontal space, allowing designs to be stacked in a compact space. The number of layers in a circuit refers to the number of conductor layers in the circuit, usually separated by dielectric layers
5G communication has the technical characteristics of high frequency, broadband, and high power density, and its demand for RF front-end devices has also increased significantly. At the same time, in order to control the volume of the assembled device, the modularization of the RF front-end is inevitable. The RF front-end module integrates the power amplifier (PA), filter (SAW, TF-SAW BAW, etc.), antenna, switch (Switch) and low noise amplifier (LNA), passive devices, etc. in one module