CLTE and CLTE-XT are high-frequency laminate materials commonly used in PCB (Printed Circuit Board) designs. These materials are engineered to provide excellent electrical performance, especially at high frequencies.
AD Series™ High Frequency Laminates Stripling and Multilayer CIircuits
The AD Series™ antenna materials, including AD250C™, AD255C™, AD300D™, and AD350A™, are engineered to meet the rigorous demands of modern RF and antenna applications. With exceptional dielectric properties, low loss performance, and high thermal reliability, these laminates support next-generation communication technologies.
The AD Series™ Antenna Materials are high-performance laminate materials specifically engineered for advanced antenna and RF (Radio Frequency) applications. These materials are designed to meet the demanding requirements of modern wireless communication systems. Below is an overview of the specific laminates in the series: AD250C™, AD255C™, AD300D™, and AD350A™.
The Printed Circuit Board (PCB) is a fundamental component of all electronic devices, serving as the “command center” that ensures their functionality. However, many business owners struggle to differentiate between PCB manufacturing and PCB assembly, often leading to suboptimal decisions.
In the world of PCB manufacturing, two main methods are commonly used: PCB prototyping and standard PCB production. Both methods play critical roles and come with their own characteristics. Reducing the time and costs associated with the development process can significantly increase the success rate of future projects. This article explores the benefits of starting with a prototype PCB for design verification before transitioning to standard PCB production assembly.
Whether in the PCB manufacturing assembly process or in actual applications, good materials are essential for the reliable performance of PCBs. Because defects in PCB assembly may cause failures in actual product applications, resulting in immeasurable losses. Therefore, we should not only pay attention to the cost of PCB production, but also the materials and quality of PCBs.
The high coefficient of thermal expansion of ceramic PCB substrates is one of the reasons for their widespread use in the electronics industry. The thermal conductivity of ceramic bases stems from its proximity to silicon while being located below the most commonly used connecting metals.