At KKPCB, we’re your expert navigator through the world of stackup choices, ensuring your electronic arsenal is perfectly equipped. Need seamless integration with your design tools? Our impedance models make it effortless. Craft efficient, impedance-aligned PCB stackups that resist bowing and twisting, optimizing performance and reliability.
A flex PCB is essentially the same thing as a non-flex board except the flexible PCB uses a flexible base material to make its circuit connections. This is most helpful for products that will likely not be stationary devices.
In order for silicon to turn into a semiconductor chip, it needs to go through the several complex process of wafer manufacturing, oxidation, photolithography, etching, deposition and ion implementation, metal wiring, Eds and packaging.
Summary: High-frequency microwave plates should be a new product of high-tech. With the continuous development of communications and computers towards high frequency and high speed, their uses will become wider and wider in the future
Excellent layer stacking is the key to ensure bypass and decoupling of the power bus, minimize transient voltage on the power layer or ground layer, and shield the electromagnetic field of the signal and power supply.
Key Takeaways
The competitiveness of new product introduction makes it critical to optimize your prototype design process for effectiveness and efficiency.
Your prototype PCB design software should exhibit essential attributes for managing component inventory, creating schematics, designing PCBs, verifying designs, and managing data.
OrCAD X delivers the essential functionality and capabilities in one program for prototype design optimization.
Key Takeaways
Understand the purpose of each component in a variable power supply, including transformers, rectifiers, capacitors, and regulators.
Learn about different topologies for variable power supplies, from discrete resistor selection to continuously variable potentiometer-based designs.
Discover how OrCAD X tools like DFM, interactive routing, constraint management, and thermal analysis can streamline the design and optimization of variable power supplies.
Key Takeaways
Stress during fabrication, such as thermal expansion and contraction, imbalanced copper distribution, and improper handling, can lead to warpage.
Utilize tools like feeler gauges, height gauges, contour gauges, optical profilometers, and Finite Element Method (FEM) simulations to accurately measure PCB warpage.
Effective design practices using OrCAD X, such as symmetrical component placement and proper copper distribution, combined with precise fabrication controls, can significantly reduce the risk of PCB warpage.
Maximize the efficiency of your design and manufacturing processes by optimizing your board development to mitigate the rigid flex PCB cost challenges
Key Takeaways
Cross-hatching significantly increases the flexibility of flex PCBs by reducing copper content.
Helps maintain optimal impedance in flex PCBs without altering dielectric thickness or signal line width.
Enables efficient manufacturing with reduced copper usage and improved resin adhesion.