2ML™ is a thermally conductive, halogen-free epoxy laminate and prepreg material developed by Rogers Corporation. It is engineered to meet the thermal management demands of high-power electronic applications, offering enhanced heat transfer characteristics while maintaining compatibility with standard PCB fabrication processes.
N4800-20 is a high-speed, low-loss multifunctional epoxy laminate and prepreg material developed by AGC Multi Material America, Inc. It is engineered for advanced multilayer printed circuit boards (PCBs) that require superior thermal performance and stable electrical properties.
Nelco® N4000-13 is a high-speed multifunctional epoxy laminate and prepreg material engineered for advanced printed circuit board (PCB) applications requiring superior thermal performance and electrical properties.
NPGN-150PYTL, NPGN-150PYR, and NPGN-150PYB are halogen-free, flame-retardant copper-clad laminates produced by Nan Ya Plastics Corporation. These materials are designed for applications requiring high thermal stability, mechanical strength, and excellent electrical properties, making them suitable for advanced electronic applications.
NP-175FR is a high-performance, high-Tg (glass transition temperature) FR-4 copper-clad laminate developed by Nan Ya Plastics Corporation. It is engineered for applications requiring superior thermal stability, mechanical strength, and electrical properties, making it suitable for advanced electronic and automotive applications.
NP-170R is a high-performance, high-Tg (glass transition temperature) FR-4 copper-clad laminate produced by Nan Ya Plastics Corporation. It is designed for applications requiring excellent thermal stability, mechanical strength, and electrical properties
The XtremeSpeed™ RO1200™ Series from Rogers Corporation comprises extremely low-loss digital circuit laminates engineered for high-speed applications requiring exceptional electrical performance and mechanical stability.
The XtremeSpeed™ RO1200 Bondply is an advanced, extremely low-loss, ceramic-filled, non-glass reinforced PTFE bonding material developed by Rogers Corporation. It is engineered for high-speed digital applications, offering exceptional electrical and mechanical performance.
The Quick Reference Processing Guidelines for RO1200 Materials provide essential recommendations to ensure optimal fabrication and performance of these advanced laminates.
PSIS – RO1200 Laminate Series refers to advanced circuit materials from Rogers Corporation designed for high-frequency and high-speed digital applications. The RO1200 laminates are part of Rogers’ XtremeSpeed™ series, offering ultra-low loss characteristics, excellent thermal stability, and outstanding mechanical reliability