Device Attachment Methods and Wirebonding Notes for RTduroid and RO4000 Series High Frequency Lamina
Rogers RT/duroid® and RO4000® series laminates are widely used in high-frequency applications such as RF and microwave circuits. Reliable device attachment and wirebonding are essential for achieving optimal performance and long-term reliability. This guide outlines best practices for attaching devices and performing wirebonding on these high-frequency laminates.
In high-frequency circuit designs, managing temperature rise is crucial for ensuring optimal performance and reliability. Rogers’ high-frequency circuit boards, such as those made with RO4000, RO3000, or RT-duroid laminates, exhibit excellent thermal and electrical properties. However, the combination of DC or RF currents and environmental conditions can lead to localized temperature increases that need to be estimated and mitigated.
RO4350B laminates are engineered for high-frequency applications requiring a balance of cost, performance, and reliability. The following starting point compensation factors are intended to assist fabricators in achieving optimal processing results while minimizing dimensional variations during manufacturing.
Product Name: RO4000® Series Laminates (RO4003C, RO4350B, RO4835)
Use: High-frequency circuit board materials
Manufacturer: Rogers Corporation
Product Name: RO4000® Series Laminates (RO4003C, RO4350B, RO4835)
Use: High-frequency circuit board materials
Manufacturer: Rogers Corporation
Rogers Corporation aims to provide high-performance laminates with integrated resistive foils that meet rigorous electrical and aesthetic standards for precision circuit fabrication. This statement outlines the key characteristics of resistive foil products, including visual appearance and resistivity performance.
Rogers RO4000® laminates, when combined with TICER® TCR Thin Film Resistor Foils, offer a unique solution for high-frequency applications requiring integrated resistive elements. These laminates provide exceptional electrical, thermal, and mechanical performance, while the integrated thin-film resistive layers simplify circuit design and reduce manufacturing complexity.
Rogers RO4000® series laminates, including RO4003C™ and RO4350B™, are advanced materials designed for high-frequency applications. They deliver excellent electrical performance, mechanical reliability, and are compatible with conventional PCB manufacturing techniques, making them ideal for RF, microwave, and high-speed digital circuits.
Rogers high-frequency laminates, including RO4003C, RO4350B, and RO4835, are widely used in applications requiring superior electrical performance and mechanical stability. These materials are essential in RF, microwave, and high-speed digital designs.
Rogers RO4000® series laminates are high-frequency circuit materials designed to deliver excellent electrical performance, mechanical stability, and cost-effectiveness. These laminates, including RO4003C™, RO4350B™, and RO4835™, are ideal for RF, microwave, and high-speed digital applications, offering compatibility with standard PCB manufacturing processes.