Practical Tips for Non-Direct Replacement
Double-check pin numbering to avoid miswiring.
Adjust external PCB components to suit the replacement IC’s characteristics.
Match power supply voltage; if it differs, adjust accordingly.
Measure IC’s static working current post-replacement for normal values; significant differences may indicate self-oscillation.
Match input and output impedance to the original PCB circuit.
Maintain tidy external leads and avoid crossings to prevent high-frequency oscillation.
In PCB design, one common question arises: if an extra layer is not required for routing, why use it? Reducing the number of layers theoretically makes the board thinner and lowers costs. However, in some cases, adding an additional layer can actually reduce costs.
Based on recent trends, improving efficiency is a key goal, and the trade-off of using slow switching devices for better EMI is not worth it. Superjunctions can improve efficiency in applications where planar MOSFETs struggle. Superjunction MOSFETs significantly reduce on-resistance and parasitic capacitance compared to traditional planar MOSFET technology. The significant reduction in on-resistance and reduced parasitic capacitance, while helping to improve efficiency, also produces fast switching transitions of voltage (dv/dt) and current (di/dt), forming high-frequency noise and radiated EMI.
As electronic products become more advanced, they encounter more sources of electromagnetic interference (EMI) that can disrupt device function and potentially harm health. This guide explores strategies for designing PCB boards with optimized electromagnetic compatibility (EMC), focusing on reducing interference and increasing product resilience.
Electrostatic Discharge (ESD) can damage sensitive components such as MOSFETs, CMOS gates, and PN junctions, leading to issues like gate damage, short circuits, and even melted wiring. This guide offers practical strategies to design PCBs that effectively prevent ESD from harming the circuit.
Before explaining the inspection work after PCB wiring is completed, we will first introduce three special PCB routing techniques. The routing of PCB LAYOUT will be explained from three aspects: right-angle routing, differential routing, and serpentine routing
PCB design translates electrical schematics into a functional product, and its quality directly impacts production efficiency and product reliability. For beginners, mastering PCB layout can be challenging despite familiarity with design software, and common issues often arise. Here, seasoned engineers from KKPCB share their PCB layout insights to help avoid these pitfalls and inspire best practices.
Addressing signal integrity (SI) issues early in the PCB design process can streamline the design and eliminate the need for corrective termination devices later. Here, we outline critical steps to maintain signal integrity, from planning through testing.
Grounding is fundamental in electronic circuit design, influencing stability, noise immunity, and overall performance. Grounding techniques range from basic single-loop analog grounding to advanced grounding methods for complex mixed-signal designs. These techniques become increasingly critical in high-frequency or high-EMC (Electromagnetic Compatibility) environments. Here’s a comprehensive overview of grounding techniques and methods for reducing ground loops to enhance stability.
Multilayer PCB design follows principles similar to double-layer design, with added structural complexity and a focus on stable signal integrity and efficient routing. With experience in double-layer PCBs, moving to multilayer designs can be manageable.
