Shenzhen KKPCB Technology Co., Ltd.’s Alumina-Zirconia substrates have high strength and toughness. Their excellent electrical and thermal properties are ideal for applications that require high reliability, such as automotive, industrial machinery, and IGBT power modules.

Features
KKPCB’s high-strength flexible Alumina-Zirconia substrates have a bending strength that is more than 1.5 times that of standard alumina substrates. The thinnest thickness can reach 150um, which can reduce thermal resistance in the thickness direction. The substrate has high density, fine structure, and excellent flatness.

Material Characteristics

ITEM		UNIT	TEST CONDITIONS	96% ALUMINA	HIGH STRENGTH	ALUMINA -ZIRCONIA
				NA-96	NA-96F1	NA-Z
MATERIAL		―	―	96%Al2O3	96%Al2O3	Al2O3-ZrO2
COLOR		―	―	WHITE	WHITE	WHITE
DENSITY		g/cm3	―	3.7	3.7	4.1
WATER ABSORPTION		%	―	0	0	0
MECHANICAL PROPERTIES	3 POINT BENDING STRENGTH	MPa	―	400	450	600
THERMAL PROPERTIES	THERMAL EXPANSION COEFFICIENT	10-6/℃	RT～400℃	6.8	6.8	7
			RT～800℃	7.8	7.8	8.1
	THERMAL CONDUCTIVITY	W/(m・K)	20℃	23	23	21
ELECTRICAL PROPERTIES	DIELECTRIC CONSTANT	―	1MHz	9.2	9.3	11.3
	LOSS TANGENT	10-4	1MHz	10	10	12
	ELECTRICAL RESISTIVITY	Ω・cm	25℃	>1014	5×1015	>1014
			300℃	1012	2×1012	1011
			500℃	1010	2×109	109
	DIELECTRIC STRENGTH	kV/mm	―	>20	>20	>20

Values are typical values

Design Guidelines

ITEM	UNIT	STANDARD	CUSTOM
DEMENSIONS	mm	190×140	～150×300
THICKNESS	mm	0.25, 0.32	0.15, 0.25, 0.32

Product Use Cases

• Laser processed substrates
• Polished substrates
• Thick film circuit substrates

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