Benefits

•Low DF and DK

•Stable electrical properties versus frequency

•Designed for high layer count multilayers

•Available in a variety of constructions

Applications

•High Speed Storage Networks

•Internet Switches / Routing Systems

•Wireless Communication Infrastructure

•Backplanes

N4800-20 is a high-performance enhanced epoxy systems for multilayer PCBs requiring maximum thermal and stable electrical performance. It is designed to be lead-free assembly compatible and CAF resistant.

Excellent Electrical Properties

⚫ Low Df electrical performance

⚫ Stable electrical properties versus frequency when tested over environmental conditions

Thermal and Mechanical Properties

⚫ Formulated to withstand multiple 260°C lead-free excursions

⚫ Very low Z-axis expansion for high reliability

⚫ Excellent performance in fine pitch designs with small material webs between through holes

⚫ Excellent peel strength

⚫ Designed for high layer count multilayers

Excellent CAF Performance

⚫ Provides excellent CAF resistance even after multiple lead-free assembly exposures

High-Tg FR-4 Processing

⚫ Processes similar to traditional high Tg FR-4 materials

⚫ 90 mins press at 193°C and 275-350 psi

Meets UL 94V-0 and IPC-4101/72 and /73 Specifications

UL file number: E36295

Properties	Conditions	Typical Value		Unit	Test Method
Electrical Properties
Dielectric Constant (50% resin content)	@ 2.5 GHz (Split Post Cavity)	3.6
	@ 10 GHz (Stripline)	3.6			IPC-TM-650.2.5.5.5
Dissipation Factor (50% resin content)	@ 2.5 GHz (Spilt Post Cavity)	0.007
	@ 10 GHz (Stripline)	0.0075			IPC-TM-650.2.5.5.5
Volume Resistivity	C – 96 / 35 / 90	108		MΩ – cm	IPC-TM-650.2.5.17.1
	E – 24 / 125	108
Surface Resistivity	C – 96 / 35 / 90	108		MΩ	IPC-TM-650.2.5.17.1
	E – 24 / 125	108
Electric Strength		4.2×104 (1660)		V/mm (V/mil)	IPC-TM-650.2.5.6.2
Thermal Properties
*Glass Transition Temperature (Tg)	DMA(°C) (Tand Peak)	210		°C	IPC-TM-650.2.4.24.3
Degradation Temperature (TGA)	Degradation Temp (TGA) (5% wt. loss)	360		°C	IPC-TM-650.2.4.24.6
T-288	Time to delamination @ 288°C	40+		minutes	IPC-TM-650.2.4.24.1
Thermal Conductivity		0.47		W/mK	ASTM E1461
Mechanical Properties
Peel Strength	1 oz (35µ) Cu After Solder Float	1.31 (7.5)		N/mm (lbf/inch)	IPC-TM-650.2.4.8
X / Y CTE	-40°C to + 125°C	10 / 14		ppm/°C	IPC-TM-650.2.4.41
Z Axis CTE Alpha 1 (50°C to Tg)		27		ppm/°C	IPC-TM-650.2.4.24
Z Axis CTE Alpha 2 (Tg to 260°C)		205		ppm/°C	IPC-TM-650.2.4.24
Z Axis Expansion	50°C to 260°C	2.0		%	IPC-TM-650.2.4.24
Young’s Modulus (X / Y)		27.6 / 25.5 (4.0 / 3.7)		GN/m2 (psix 106)	ASTM D3039
Poisson’s Ratios (X / Y)		0.177/0.154
Chemical / Physical Properties
Moisture Absorption		0.07		wt. %	IPC-TM-650.2.6.2.1

DMA is the preferred method for measuring Tg – other methods may be less accurate.

• All test data provided are typical values and not intended to be specification values. For review of

critical specification tolerances, please contact a company representative directly

• N4000-20 can be manufactured in laminate thickness from 2 mil (0.05 mm) and up.

• N4000-20 is available in most common panel sizes.

• Please contact AGC for availability of any other constructions, copper weights glass styles including

very low profile copper and RTFOIL®