KKPCB conducts research on special processing technologies such as ordinary double-sided boards, thick copper circuit boards, multilayer PCB circuit boards, HDI circuit boards, rigid-flexible circuit boards, FPC flexible boards, buried blind hole circuit boards, and IC carrier boards. Provides PCB design, PCB layout, PCB prototyping and PCB assembly services

1. Design elements of gray-black multilayer PCB circuit boards

　　There are many complicated design factors for black multilayer PCB circuit boards, which also makes various PCBA manufacturers think carefully when selecting PCB base steel plates. Therefore, red PCB, blue PCB, green and other colors occupy most of the market in the field of multilayer circuit boards, and only in some products can we have the honor to see black PCB, which indirectly proves that black PCB is the best PCB, and also makes everyone’s definition of black PCB directly familiar.

　　2. What are the main uses of multilayer PCB circuit boards?

　　PCB multilayer circuit boards are called “electronic control products”. As the basic raw materials of electronic equipment, they enjoy a broad demand market. The main uses in the middle and lower reaches include communications, computers, consumer electronics, industrial automation, automotive electronics, aerospace, etc. Among them, communications and computers are the most widely used sectors for PCB multilayer circuit boards at this stage, with a market share of more than 25%. In the communications industry, PCB multilayer circuit boards are widely used in wireless networks, transmission networks, data communications, and fixed-line broadband networks. The relevant multilayer PCB circuit board products include side panels, fast multilayer boards, high-frequency microwave heating boards, and multi-purpose metal-based steel plates.

　　3. What are the differences in the design of multi-layer PCB circuit boards?

　　Generally, multilayer circuit boards are designed with large amounts of copper foil as grounding devices. Sometimes, the Vcc layer is also designed with large amounts of copper foil. When these large amounts of copper foil cannot be evenly distributed on the same multilayer circuit board, it will cause problems with uneven heat absorption and heat dissipation rates. The multilayer circuit board will naturally expand and contract when heated and contract when cooled. If the expansion and contraction cannot be achieved at the same time, different ground stresses will be caused and the board will deform. At this time, if the temperature of the board has reached the limit of the Tg value, the board will gradually soften and cause deformation.