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Engineering Technology
RO4350B Po st Etch Movement vs. Post Lamination Movement

RO4350B Starting Point Compensation Factors

This study was conducted to evaluate dimensional movement of Rogers RO4350B Product through the circuit fabrication process. The study was conducted using Six Sigma tools and the DMAIC process as a guideline for the evaluation (Define, Measure, Analyze, Improve, and Control). The Six Sigma project was initiated as a joint exercise between Rogers Corporation and printed circuit board manufacturer Cirtech Inc.

Notes:

The following information was generated using a uniformly distributed dot matrix image encompassing the critical parameters illustrated in the matrix below. Rogers RO4450B standard lamination cycle was used as outlined in Rogers’ “RO4400 Series Prepreg Data Sheet and Processing Guidelines”. The machine and cross machine directions (MD, CMD) are based on an 18” X 24” panel size. MD is the 18” dimension and CMD is the 24” dimension.

Critical Parameters

Product
Grade
Dielectric
Thickness
Copper
Weight
% Cu.
Etch
% Cu.
Etch
% Cu.
Etch
Post
Process
Post
Process
RO4350 0.0066
0.010
0.020
1 oz.
1 oz.
1 oz.
25%
25%
25%
50%
50%
50%
75%
75%
75%
X
X
X
X
X
X
RO4350
0.0066
0.010
0.020

0.5oz
0.5oz
0.5oz

25%
25%
25%

50%
50%
50%

75%
75%
75%

X
X
X

X
X
X

Materials were measured for dimensional change in both the post etch and post lamination conditions. Results of this analysis indicate that generally 80% of the movement generated from these two processes is experienced during the lamination cycle.

RO4350B 0.020" 1oz Post Lamination Movement
 MD-CMD X-bar

0.0066” Thx. Post
MD
Etch
CMD
   Mils/in.
    X-bar
Post
MD
Lamination
CMD
 Mils/in.
X-bar
0.5oz 25% -0.0075000  -0.1000000  -0.0537500  -0.2000000  -0.4900000  -0.3450000 
0.5oz 50% -0.0125000  -0.0800000  -0.0462500  -0.2200000  -0.4400000  -0.3300000 
0.5oz 75% -0.0425000  -0.0025000  -0.0225000  -0.1900000  -0.4150000  -0.3025000 
0.010” Thx MD CMD X-bar MD CMD X-bar
0.5oz 25% -0.0230000  -0.1050000  -0.0640000  -0.2800000  -0.4400000  -0.3600000 
0.5oz 50% -0.0280000  -0.0310000  -0.0295000  -0.2450000  -0.4350000  -0.3400000 
0.5oz 75% -0.0100000  -0.0350000  -0.0225000  -0.2250000  -0.3700000  -0.2975000 
0.020” Thx MD CMD X-bar MD CMD X-bar
0.5oz 25% -0.0450000  -0.0875000  -0.0662500  -0.3500000  -0.3650000  -0.3575000 
0.5oz 50% -0.0425000  -0.0375000  -0.0400000  -0.3100000  -0.3000000  -0.3050000 
0.5oz 75% -0.0225000  -0.0325000  -0.0275000  -0.2750000  -0.2600000  -0.2675000 
  Post Etch Mils/in. Post Lamination Mils/in.
0.0066” Thx MD CMD X-bar MD CMD X-bar
1oz 25% -0.1175000  -0.2400000  -0.1787500  -0.4100000  -0.6100000  -0.5100000 
1oz 50% 0.0000000  -0.1175000  -0.0587500  -0.2450000  -0.5400000  -0.3925000 
1oz 75% 0.0700000  -0.0350000  0.0175000  -0.1150000  -0.3450000  -0.2300000 
0.010” Thx

1oz 25%
1oz 50%
1oz 75%
MD

-0.1075000
-0.0150000
-0.0550000
     CMD

-0.1500000
-0.0850000
-0.0350000
    X-bar

-0.1287500
-0.0500000
-0.0450000
MD

-0.3350000
-0.2800000
-0.1750000
CMD

-0.6450000
-0.4250000
-0.2550000
      X-bar

  -0.4900000
  -0.3525000
  -0.2150000
0.020” Thx

1oz 25%
1oz 50%
1oz 75%
MD

-0.1175000
-0.0250000
-0.0240000
     CMD

-0.0400000
-0.0150000
-0.0300000
    X-bar

-0.0787500
-0.0200000
-0.0270000
MD

-0.2750000
-0.2450000
-0.2300000
CMD

-0.3500000
-0.3000000
-0.2100000
      X-bar

  -0.3125000
  -0.2725000
  -0.2200000

For questions or comments please do not hesitate to contact your Rogers Corporation representative.

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