92ML is a thermally conductive, halogen-free epoxy laminate and prepreg material developed by Rogers Corporation. It is engineered to meet the thermal management demands of high-power electronic applications, offering enhanced heat transfer characteristics while maintaining compatibility with standard PCB fabrication processes.

92ML Key Features:

• High Thermal Conductivity: With a thermal conductivity of up to 2.0 W/mK, 92ML™ effectively dissipates heat, reducing hotspots and improving overall thermal management.
• High Glass Transition Temperature (Tg): A Tg of approximately 160°C ensures stability and reliability under elevated temperatures, making it suitable for lead-free soldering processes.
• Flame Retardancy: 92ML™ is halogen-free and meets UL 94 V-0 flammability standards, contributing to environmentally friendly and safe electronic designs.
• Low Coefficient of Thermal Expansion (CTE): The material exhibits a low Z-axis CTE of 22 ppm/°C below Tg and 175 ppm/°C above Tg, ensuring dimensional stability during thermal cycling.

Applications:

• High-Power Electronics: Ideal for motor controllers, power supplies, converters, and automotive electronics where efficient heat dissipation is crucial.
• LED Modules and Lighting: Enhances thermal management in high-brightness LED applications, extending component lifespan and performance.

Technical Specifications:

• Dielectric Constant (Dk): Approximately 5.5 at 1 MHz, supporting effective signal transmission.
• Dissipation Factor (Df): Approximately 0.02 at 1 MHz, indicating low signal loss.
• Decomposition Temperature (Td): Exceeds 350°C, indicating robust thermal stability suitable for high-temperature processing.
• Electrical Strength: Greater than 750 volts/mil, suitable for high-power handling applications.

For detailed technical specifications and processing guidelines, please refer to the 92ML™ Data Sheet.